Guangpu Co., Ltd. adjusts the construction plan of the packaging and testing project, and postpones the fundraising project to 2028

On July 17, Guangpu Co., Ltd. announced that the company plans to extend the date when the "Photoelectric Sensor Device Integrated Packaging, Testing, R&D and Industrialization Project" reaches the scheduled usable state to June 30, 2028. This adjustment does not involve changes in the project implementation entity, use of raised funds and investment scale.

It is understood that in July 2024, Guangpu Co., Ltd. adjusted the arrangement of some fundraising projects and used the remaining raised funds and accumulated income from the original "High Optical Power Ultraviolet Solid State Light Source Product Construction Project" and "LED Lighting Product Intelligent Production and Construction Project" to add "Photoelectric Sensor Device Integrated Packaging, Testing, R&D and Industrialization Project" and "Overseas Intelligent Manufacturing Industry Base Expansion Project."

Guangpu Co., Ltd. stated that the core workshop and main production processes of the project have been put into operation and are in the production capacity ramping stage. The delay is mainly due to the continued upgrade of the optoelectronic integrated device packaging process and changes in end customer demand. The company needs to further optimize the process flow and adjust some equipment to improve project construction quality and subsequent operational efficiency.

Guangpu Co., Ltd. also stated that this extension is a prudent adjustment based on the project construction progress, changes in market demand and the company's long-term development plan. It only involves changes in the construction cycle and will not change the investment direction and scale of the raised funds, nor will it have a major adverse impact on the company's production and operations.