Korean media: Samsung Display has established a glass interposer R&D team

According to Korean media The ELEC, Samsung Display has recently formed a glass interposer research and development team and has launched preliminary research. Samsung Display plans to focus its research on patterning technology that forms a rewiring layer on glass through a photolithography process.

An industry insider explained: "Panel companies have the basic technology to repeatedly perform metal evaporation, photolithography, and etching processes on glass to form fine circuits. The core of the glass interposer is also the RDL wiring process, and Samsung Display can maximize its existing capabilities."

The interposer is a key component in semiconductors and is used as an intermediate substrate. Replacing the current mainstream silicon material with glass can improve flatness and achieve ultra-fine circuits. The low thermal expansion coefficient of glass also suppresses warpage caused by differences in thermal deformation between the chip and the substrate. Glass interposers have emerged as the next generation core technology supporting AI high-performance semiconductors.

RDL is a tiny wiring layer that redistributes signals connected through glass vias to specific locations. It connects semiconductor chips and substrates by repeatedly stacking insulating films and copper wiring. The interposer used for AI semiconductors needs to uniformly form dozens of layers of RDL, highlighting the importance of high-precision patterning technologies such as photolithography, exposure, etching, and electroplating. In recent years, the focus of technology competition for glass materials for semiconductor packaging has shifted from the original TGV process to RDL implementation.