Single-quarter revenue hits record high, Huicheng shares announces first half of 2026 results

On August 12, Huicheng Shares released its results for the first half of 2026.

During the reporting period, the company achieved revenue of 959 million yuan, a year-on-year increase of 10.67%; the net profit attributable to shareholders of the listed company was 5.0123 million yuan, a year-on-year decrease of 94.78%.

According to data, Huicheng Co., Ltd.’s main business is advanced packaging and testing of integrated circuits. During the reporting period, it focused on the field of display driver chip packaging and testing, and actively expanded into high value-added fields such as next-generation advanced packaging and memory chips, and automotive chips.

Huicheng shares stated that in the first half of 2026, affected by structural changes in downstream display panels and fluctuations in demand for end products, the company's DDIC packaging and testing business was under pressure to a certain extent, and the overall bottoming out trend was shown during the reporting period. At the same time, in order to comply with the industry trend of advanced packaging technology evolving towards 2.5D/3D and heterogeneous integration, grasp the advanced packaging demand driven by AI infrastructure construction, and continue to enhance the company's value, the company is actively deploying the HITS advanced packaging technology platform to create a new growth curve.

During the reporting period, the company's operating income increased by 10.67% year-on-year, reaching 959 million yuan; in the second quarter of 2026, the single-quarter revenue reached a record high in the company's history, reaching 548 million yuan. In the future, the company will continue to reduce costs and increase efficiency and expand the market to improve production capacity utilization, actively repair and improve overall profitability.

Strategic layout: Focus on new displays and advanced packaging

It is worth mentioning that since July, Huicheng has disclosed two investment plans: first, it plans to participate in the establishment of a 2 billion yuan industrial fund, focusing on new generation information technology fields such as new displays; second, it plans to invest no less than 7.5 billion yuan from its subsidiary to build HITS advanced packaging R&D industrialization projects to further improve the advanced packaging layout in fields such as AI and high-performance computing.

Among them, the 2 billion yuan industrial fund will focus on investing in the new generation of information technology industry, focusing on integrated circuits, new displays, smart terminals, industrial Internet, 5G/6G, aerospace information, cloud computing, big data, software and information technology services, quantum technology and other fields, as well as the upstream and downstream of the industrial chain such as related materials and equipment. Huicheng Co., Ltd. will serve as a limited partner and invest 200 million yuan with its own funds, with the subscribed capital accounting for 10% of the total fund size.

Huicheng shares stated that this investment aims to leverage the industrial resources and investment experience of professional investment institutions to seize the development opportunities of the new generation of information technology industry, broaden investment channels, and further enhance the company's profitability and development quality.

The HITS advanced packaging R&D industrialization project is constructed by Shanghai Zhenglong Xinchuang Microelectronics Co., Ltd., a subsidiary of Huicheng Co., Ltd. The total investment of the project is expected to be no less than 7.5 billion yuan, and the construction period is approximately 42 months.

According to the announcement, HITS advanced packaging technology uses an architecture based on an organic interposer to achieve wafer-level integration of multiple chips in a single package to improve chip performance, integration and heat dissipation efficiency. The project will focus on key advanced packaging technologies such as ultra-narrow pitch bump bonding, ultra-fine line high-speed interconnection, ultra-large chip system integrated packaging, high-density interconnection and fine-pitch rewiring layers.

Huicheng Technology pointed out that this project will help the company improve its advanced packaging technology layout, seize development opportunities in the AI and HPC markets, and further enhance its competitiveness in the advanced packaging field.

Capital operation: Steady advancement of Hong Kong stock IPO to support globalization strategy

In addition to technology and production capacity layout, Huicheng Shares steadily advanced its listing plan in Hong Kong during the reporting period. The company plans to issue overseas listed foreign shares and list them on the main board of the Hong Kong Stock Exchange. The application materials have been submitted and published.

The prospectus shows that the funds raised from this Hong Kong stock listing are intended to be used to expand automotive-grade IC packaging and testing production capacity, upgrade HITS research and development platforms, strategic investments in the industry chain, and supplement working capital.

Huicheng shares stated that its listing in Hong Kong is to further promote the company's global development strategy, enhance brand influence and core competitiveness, consolidate its leading position in the industry, make full use of the resources and mechanism advantages of the international capital market, optimize the capital structure, expand diversified financing channels, continue to attract and gather outstanding talents, and comprehensively improve corporate governance and comprehensive strength.