Recently, Guangdong Shengtian Optoelectronics Semiconductor Optoelectronic Device Packaging Technology R&D and Production Headquarters Project officially laid the foundation stone.
According to data, the project is invested and constructed by Guangdong Shengtian Microelectronics Co., Ltd., covering an area of 13,333 square meters and a construction area of 46,500 square meters. It is expected to invest 500 million yuan and plans to build a modern industrial base integrating R&D centers, intelligent manufacturing bases and professional optoelectronic testing laboratories.In addition, the project is expected to be completed and put into production in 2026, and is expected to contribute an average annual output value of 500 million to 1 billion yuan; after completion, it will strengthen key links in the midstream of the optoelectronics industry chain.It is understood that its parent company, Shenzhen Shengtian Optoelectronics Technology Co., Ltd., has products covering the entire industry chain of LED display devices and is widely used in general lighting, commercial displays, smart homes, automotive electronics and other fields. The key layout of innovative products such as vehicle-mounted Mini LED backlights and automotive-grade ADB modules will form a "packaging-application" full chain closed loop with downstream companies such as Unilumin Technology and Yuanheng Optoelectronics in the region, effectively filling the midstream links of the regional industrial chain.
