Dekrypton Microelectronics completed a new round of financing to accelerate the development of millimeter wave wireless connection chips

According to the official website of Qichacha, on June 8, Dekrypton Microelectronics Co., Ltd., a millimeter wave wireless connection chip design company, completed a new round of financing, jointly invested by Zhidao Capital and Kunshi Capital.

Up to now, Dekrypton Micro has completed 7 rounds of financing, and has introduced many investment institutions such as Nova Nebula, Qirong Venture Capital, Legend Capital, Puhua Capital, Small and Medium-sized Venture Capital, Shenzhen Venture Capital, Shenzhen Angel Fund of Funds, Zhidao Capital and Kunshi Capital.

Dekrypton Micro was established in February 2021 and is located in Guangming District, Shenzhen. The company uses millimeter wave frequency bands as its technical basis to provide wireless interconnection chip solutions covering high- and low-speed data and high-definition audio and video transmission, focusing on uncompressed and low-latency transmission capabilities. Its products are used in many fields such as LED displays, industrial manufacturing, automotive electronics, AI data centers, and consumer electronics.

In the past year, Dekr Micro has continued to promote technology sinking and adaptation expansion. On the basis of realizing wireless data transmission and wireless power supply of LED displays, it has further extended its capabilities to the COB module level, and strengthened its compatibility with mainstream interface protocols such as SPI, Ethernet, LVDS, HDMI, USB, RGB, etc., to improve system adaptability and deployment flexibility.

Currently, its millimeter wave wireless connection chips have achieved large-scale mass production and shipment. The company stated that millimeter wave wireless connections are evolving from local optimization of "replacing cables" to system capabilities of "structure-level wireless interconnection", providing a replicable engineering path for commercial displays in terms of assembly efficiency, reliability and form innovation.

At the ISLE exhibition in March this year, Dekrypton Microelectronics demonstrated the progress of millimeter wave wireless connection solutions in scenarios such as splicing boxes, all-in-one machines and wireless three-in-one boards.

Among them, in the splicing box application, by reducing the number of wire harnesses and interfaces, the assembly efficiency is said to be increased by about 70%; in the all-in-one solution, a fully wireless structure is built with DK1668 as the core, and the assembly consistency is optimized through automatic module alignment design. The assembly time of the 170-inch screen can be compressed to less than 1 hour; in the wireless three-in-one board solution, communication, reception and power supply are integrated on a single board, reducing the complexity of the hub board and wiring structure.