Huawei Technologies Co., Ltd. obtains patents for LED chip packaging modules, display screens and manufacturing methods

According to information from the State Intellectual Property Office on April 22, Huawei Technologies Co., Ltd. has obtained a patent titled "LED chip packaging module, display screen and manufacturing method", with the authorization announcement number CN111933630B, and the application date is July 2020.

Tianyancha data shows that Huawei Technologies Co., Ltd. was established in 1987 and is located in Shenzhen. It is an enterprise mainly engaged in the manufacturing of computers, communications and other electronic equipment. The registered capital of the company is RMB 40,941,131,820. Through Tianyancha big data analysis, Huawei Technologies Co., Ltd. has invested in a total of 50 companies and participated in 5,000 bidding projects. In terms of property clues, there are 5,000 pieces of trademark information and 5,000 pieces of patent information. In addition, the companies also have 1,534 administrative licenses.